Adhesive Formulations Engineer

Drive Technological Advancements

Pibond Oy is a rapidly growing innovator of materials used in the semiconductor industry. As a Polymer Chemist or Material Scientist, you will have the opportunity to drive technological advancements in semiconductor packaging by developing novel formulations and products.

As part of our research and development team, you will collaborate closely with senior product development specialists and partners to design, develop, and execute new adhesive formulations and products. Your work will involve leading one or multiple R&D projects critical to business success and ensuring timely project milestone advancement through your contributions.

Key Responsibilities:

• Develop Advanced Semiconductor Packaging Solutions: Collaborate with cross-functional teams to design and develop advanced semiconductor packaging solutions that meet product specifications and requirements.
• Evaluate New Materials and Technologies: Evaluate new materials, technologies, and equipment for packaging enhancements.
• Optimize Production Routes: Develop efficient production routes and/or scale-up methods for supply chain optimization.
• Communicate Research Findings: Report and communicate research findings internally and to partners and customers globally.
• Mentor Technical Staff: Guide other technical staff to complete tasks and mentor their development.

Requirements:

• Strong Analytical and Problem-Solving Skills: Possess strong analytical and problem-solving skills with the ability to troubleshoot and resolve packaging-related issues.
• Effective Communication: Demonstrate effective communication and collaboration skills.
• Minimum M.S. Level Education: Hold a minimum M.S. level education in chemistry, chemical engineering, or materials science.
• Understanding of Semiconductor Packaging: Possess an understanding of semiconductor packaging principles, techniques, and methodologies.
• Knowledge of Materials: Have knowledge of materials used in semiconductor packaging, such as solder, epoxy, mold compounds, and substrates.